製程能力
| 製程能力 | |||
| 項目 | PCB | FPC | MCPCB |
| 型態 | 單、雙面板、多層板、1~4階盲埋孔板 | 單、雙面板、多層板、多單板、軟硬結合板 | 單面板、單側雙面板、金屬夾層板 |
| 基材 | CEM、FR4、FR5等玻纖材 板厚=> 0.1~3.2mm |
2Layer or 3Layer等PI 板厚=> 0.1mm(min) |
鋁、銅之金屬材 板厚=> 0.6~2.0mm |
| 工作排版面積 | 510*750mm(max) | 450*500mm(max) | 510*610mm(max) |
| 內層線路 | 線寬/線距=>3mil/3mil | 線寬/線距=>3mil/3mil | 線寬/線距=>4mil/4mil |
| 壓合銅厚 | 0.5oz~6oz | 0.5oz~2oz | 1oz~3oz |
| 鑽導通孔(PTH) | Ø=4mil 偏移度±3mil 孔徑公差3mil |
Ø=4mil 偏移度±3mil 孔徑公差3mil |
Ø=6mil 偏移度±3mil 孔徑公差3mil |
| 外層線路 | 線寬/線距=>3mil/3mil | 線寬/線距=>3mil/3mil | 線寬/線距=>4mil/4mil |
| 防焊印刷 | 膜厚0.7~1.5mil 隔焊下墨間距4mil 曝光偏移度3mil |
膜厚0.4~0.7mil 隔焊下墨間距4mil 曝光偏移度3mil |
膜厚0.7~1.5mil 隔焊下墨間距4mil 曝光偏移度3mil |
| 文字印刷 | 下墨線寬5mil(min) | 下墨線寬5mil(min) | 下墨線寬5mil(min) |
| 表面處理 | 無鉛噴錫、化金、鍍金、化銀、鍍銀、OSP | 化錫、化金、鍍金、化銀、鍍銀、鍍錫、OSP | 無鉛噴錫、化金、化銀、電鍍金、電鍍銀、OSP |
| 鑽孔定孔(NPTH) | Ø=1.0~6.5mm 偏移度±2mil 孔徑公差±2mil |
Ø=1.0~6.5mm 偏移度±2mil 孔徑公差±2mil |
Ø=1.0~6.5mm 偏移度±2mil 孔徑公差±2mil |
| 成型 | CNC、模沖、V-cut | 刀模、蝕刻模、鋼模 | CNC、模沖、V-cut |
| 測試 | O/S測試 | O/S測試 | O/S測試 |
| 品檢 | 成品檢驗規範 | 成品檢驗規範 | 成品檢驗規範 |
| 包裝出貨 | 真空氣泡袋包裝 | 夾鏈帶包裝、tray盤包裝 | 真空氣泡袋包裝、tray盤包裝 |
